27 - 28 October, 2020

Virtual Conference

2018 Keynotes

2018 Keynotes

Driving Digitalization With A Boundary Free Innovation Platform

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We are witnessing a radical change of the way products are created, produced, and utilized. As a consequence of continuing digitalization, leading technology companies are pursuing the idea of a complete, high fidelity “digital twin” that makes the boundaries between the design process of mechanical parts, electronics, embedded software, sensors and specialized IC and sensor technology are disappearing.

This digital twin is becoming a necessity. Autonomous driving, as an example, puts an end to the feasibility of verifying the functionality of today's and tomorrow's vehicles through road testing. A complete virtualization of mechanical properties, physics, electronics, real-time software, down to the sensor data processing at the IC level is the only avenue to verify the safety and functionality of advanced driver assistance systems and autonomous functions. In the same way, technologies like additive manufacturing, advanced materials and exploding variation require an extensive virtualization of the production process to accelerate verification.

IoT technology provides an unprecedented amount of information and feedback for systems in operation. It is already giving a competitive advantage to manufacturers who are going beyond “analytics” and tap into the models created during development and production to utilize the vast amounts of available data in the optimization of the system.


Biography: Dr. Stefan Jockusch is vice president of Strategy for Siemens PLM Software, a business unit of the Siemens Digital Factory Division. Dr. Jockusch drives strategic business planning and market intelligence as well as coordinates business activities across all Siemens PM Software business segments and with Digital Factory Division leadership. Dr. Jockusch has served in a number of business leadership and R&D management roles, driving the development and market introduction of radically innovative mechatronic systems, Prior to his current assignment, Dr. Jockusch was vice president of Automotive Industry Strategy, leading the company’s business development and portfolio planning efforts for the automotive industry.  He began his career at Siemens as a management consultant with Siemens Corporate Technology. He later moved to Siemens AG as executive board assistant for the industry, transportation and technology sectors, where he led several strategic initiatives. A U.S. and German citizen with broad international experience, he relocated to the United States in 2001 and later decided to make the U.S. his family’s permanent home. Stefan holds a PhD summa cum laude in natural sciences from University of Bielefeld and a master’s degree in physics from the University of Göttingen.



Accelerating IoT Device Development - from Silicon to Developer Tools

The Internet of Things is accelerating, thanks to the broad availability of affordable building blocks for IoT devices, combined with ubiquitous wireless connectivity, cloud computing and artificial intelligence. ST has a broad offering for developers of IoT devices and applications as well as software and hardware tools to make prototyping and industrialization faster and easier. The development of IoT SoCs pose a number of challenges for chipmakers in order to enable successful first-time silicon and fast bring-up. This talk addresses these topics as well as some of the perspectives for IoT applications.


Biography: Philippe Magarshack is MDG Group Vice President at ST Microelectronics, responsible for Microcontrollers and Digital ICs Group (MDG) Special Projects. From 1985 to 1989, Magarshack worked as a microprocessor designer at AT&T Bell Labs in the USA, after which he joined Thomson-CSF in Grenoble, France, and took responsibility for libraries and ASIC design kits for the military market. In 1994, Magarshack joined the Central R&D Group of SGS-THOMSON Microelectronics (now STMicroelectronics), where he held several roles in CAD and Libraries management for advanced integrated-circuit manufacturing processes. In 2005, Magarshack was appointed Group Vice President and General Manager of Central CAD and Design Solutions at STMicroelectronics’ Technology R&D and Manufacturing organization. In 2012, he was promoted to ST’s Executive Vice President in charge of Design Enablement & Services. Magarshack has been President of the Minalogic Collaborative R&D Cluster in Grenoble since June 2014. Philippe graduated with an engineering degree in Physics from Ecole Polytechnique, Palaiseau, France, and with an Electronics Engineering degree from Ecole Nationale Supérieure des Télécommunications in Paris, France.