The Internet of Things is accelerating, thanks to the broad availability of affordable building blocks for IoT devices, combined with ubiquitous wireless connectivity, cloud computing and artificial intelligence. ST has a broad offering for developers of IoT devices and applications as well as software and hardware tools to make prototyping and industrialization faster and easier. The development of IoT SoCs pose a number of challenges for chipmakers in order to enable successful first-time silicon and fast bring-up. This talk addresses these topics as well as some of the perspectives for IoT applications.
Biography: Philippe Magarshack is MDG Group Vice President at ST Microelectronics, responsible for Microcontrollers and Digital ICs Group (MDG) Special Projects. From 1985 to 1989, Magarshack worked as a microprocessor designer at AT&T Bell Labs in the USA, after which he joined Thomson-CSF in Grenoble, France, and took responsibility for libraries and ASIC design kits for the military market. In 1994, Magarshack joined the Central R&D Group of SGS-THOMSON Microelectronics (now STMicroelectronics), where he held several roles in CAD and Libraries management for advanced integrated-circuit manufacturing processes. In 2005, Magarshack was appointed Group Vice President and General Manager of Central CAD and Design Solutions at STMicroelectronics’ Technology R&D and Manufacturing organization. In 2012, he was promoted to ST’s Executive Vice President in charge of Design Enablement & Services. Magarshack has been President of the Minalogic Collaborative R&D Cluster in Grenoble since June 2014. Philippe graduated with an engineering degree in Physics from Ecole Polytechnique, Palaiseau, France, and with an Electronics Engineering degree from Ecole Nationale Supérieure des Télécommunications in Paris, France.