Technical Program Committee - Engineering Track

  • MartinRuhwandl.jpeg
    TPC Chair
    Martin Ruhwandl

    Infineon Technologies AG

Ahmet Cagri Bagbaba, Cadence Design Systems
Rafal Baranowski, Robert Bosch GmbH
Balan Bogdan, Infineon Technologies
Markus Brosch, Infineon Technologies
Mark Burton, Qualcomm
Francois Cerisier, AEDVICES
Danilo Cirovic, Veriest Solutions
Philippe Cuenot, Continental
Thorsten Dworzak, Infineon Technologies
Karsten Einwich, COSEDA Technologies
Harry Foster, Siemens
Darren Galpin, Infineon Technologies
Joachim Geishauser, NXP Halbleiter GmbH
Johannes Grinschgl, Infineon Technologies
Edgar Iglesias, AMD
Samin Ishtiaq, Riverlane
Eric Jenn, Thales Avionics
Sriram Kazhiyur Sounderrajan, Samsung
Thomas Klotz, Bosch Sensortec
Tim Kogel, Synopsys
Aman Kumar, Infineon Technologies
Djones Lettnin, Infineon Technologies
Daniele Ludovici, Intel

Laurent Maillet-Contoz, STMicroelectronics
Aparna Mohan, Groq
Chandrakanth N Betageri, Intel Corporation
Alessandra Nardi, Synopsys
Bryan Daniel Olmos Suquillo, Infineon Technologies
Ram Babu Penugonda, Google
Clemens Roettgermann 
Martin Ruhwandl, Infineon Technologies
Vikas Sachdeva, Real Intent
Pradeep Salla, Siemens
Christian Sauer, Synopsys
Yogish Sekhar 
Uwe Simm, Cadence Design
Sebastian Simon, Infineon Technologies
Teodor Staiculescu, Infineon Technologies
Clemens Süßmuth, Infineon Technologies
Nikhil Tambekar, Nokia Networks
Walter Tibboel, NXP Semiconductors
Bhaskar Vedula, Intel Corporation
Andrei Vintila, AMIQ Consulting
Thilo Voertler, Coseda Technologies GmbH
Roger Witlox, Synopsys
Asheque Mohammad Zaidi, Infineon Technologies

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