Technical Program Committee - Engineering Track

  • MartinRuhwandl.jpeg
    TPC Chair
    Martin Ruhwandl

    Infineon Technologies AG

  • joachim_geishauser.jpg
    TPC Vice-Chair
    Joachim Geishauser

    NXP Semiconductors

Liliana Andrade, Universite Grenoble Alpes
Ahmet Cagri Bagbaba, Cadence Design Systems
Rafal Baranowski, Robert Bosch GmbH
Naik Basavaraj, Infineon Technologies AG
Alex Bertea, Infineon Technologies
Shantanu Bhattacharjee, Nokia Networks
Balan Bogdan, Infineon Technologies
Mark Burton, Qualcomm
Francois Cerisier, AEDVICES CONSULTING
Danilo Cirovic
Philippe Cuenot, Continental
Thorsten Dworzak, Infineon Technologies AG
Karsten Einwich, COSEDA Technologies
Harry Foster, Siemens EDA
Darren Galpin, UniSemi Power Ltd
Edgar Iglesias, AMD
Samin Ishtiaq, Riverlane Ltd
Tosin Jemilehin
Eric Jenn, Thales Avionics
Sriram Kazhiyur Sounderrajan, Samsung
Thomas Klotz, Bosch Sensortec
Tim Kogel, Synopsys
Aman Kumar, Infineon Technologies

Djones Lettnin, Infineon Technologies AG
Mark Litterick, Verilab
Daniele Ludovici, Intel
Laurent Maillet-Contoz, STMicroelectronics
Alessandra Nardi, Synopsys
Jasminka Pasagic
Ram Babu Penugonda, Google
Clemens Roettgermann
Vikas Sachdeva, Real Intent
Pradeep Salla, Siemens
Christian Sauer, Synopsys
Yogish Sekhar
Uwe Simm, Cadence Design Systems
Teodor-Nicolae Staiculescu, Infineon Technologies
Clemens Süßmuth, Infineon Technologies
Nikhil Tambekar, Nokia Networks
Manfred Thanner, NXP Semiconductors
Walter Tibboel, NXP Semiconductors
Andrei Vintila, AMIQ Consulting
Thilo Voertler, Coseda Technologies GmbH
Joen Westendorp
Roger Witlox, Synopsys
Asheque Mohammad Zaidi, Infineon Technologies AG